Fabrication & modulation

• Micro-nano fabrication of soft sensors and its packaging techniques (including their morphologies) enhance sensor precision and adaptability for various applications. Micro-nano fabrication methods using laser technology enable sensors to achieve higher precision, robustness, and repeatability, which can surpass the usability of existing sensors.

Figure 1. Schematic images of micro-nano fabrication process and modulated crack-based strain sensors.

• 3D morphological control is crucial for crack-based sensors, as it influences the morphologies of the cracks, which in turn determine the properties of the sensor. Micro-nano fabrication methods enable precise control over the crack's morphology, thereby allowing for tailored performance of the sensor as required.

Figure 2. 3D morphological control of crack-based strain sensors

Soft Packaging

• Soft packaging is a crucial component in protecting flexible and innovative electronics from external environments. Flexible electronics enhance the mechanical advantages of conformal contact with complex surfaces and reduce the mechanical mismatch between human and device interfaces. Soft packaging plays a vital role in ensuring that these advanced devices maintain stable and reliable operation, safeguarding them against external factors while maximizing their performance in advanced healthcare applications.

Figure 3. Description of the one-step laser packaging method and evaluation of the sensor, followed by the application of measuring the blinking of a human eye.